IEEE TBioCAS Special Issue - Electronic Circuits and Systems Challenge in Large-Scale Neural Recording and Stimulation (NeuralRS19)

Submitted by guoxing.wang on April 22, 2019 - 9:47pm

CALL FOR PAPERS FOR THE SPECIAL ISSUE

PDF iconneuralrs19_callforpapers.pdf

Understanding the brain function and modulation thereof at multi-scale levels requires large-scale neural interfaces.  While paradigm-shifting approaches are being searched to increase the spatiotemporal resolution, a technology bottleneck has emerged in transfer of such massive information to the extracorporeal units. Collecting neural signals through thousands of electrodes/sensing units built into highly compact 2D or 3D structures and interconnecting them to the first stage of amplification has been a major challenge for the microfabrication technology. This special issue of the IEEE Transactions on Biomedical Circuits and Systems will focus on the electronic circuits and systems aspect of the challenge facing the large-scale neural recording and modulation technology. Although these systems are usually designed considering that they will ultimately be implanted in human subjects, they are for the time being mostly designed for animal implantation as an investigational tool for neurosciences. We are inviting papers dealing with all aspects of neural recording and stimulation electronics that can be scaled up to thousands of channels. The papers on wireless electronics for optical, electromagnetic, or acoustic transfer of data to and from outside the body and large-scale digitizing and multiplexing electronics are welcome. Those studies addressing the issue of interconnecting a large number of electrode contacts to the first stage of electronics will also be considered. A list of potential topics includes but not limited to:

  • Low-power, high-channel-count implantable neural amplifiers/digitizers/multiplexers,
  • Wireless data transfer using optical, electromagnetic, ultrasound and acoustic techniques,
  • High-speed, real-time neural data transfer and storage electronics and protocols,
  • Micro-fabricated circuits for connecting large-channel-count neural electrodes to electronics,
  • Circuits and systems for generation of multi-channel neural stimulation waveforms.

The manuscript for TBioCAS must be submitted online using the IEEE TBioCAS manuscript template and “Information for Authors”, via IEEE Manuscript Central (link). Authors should select “Regular Paper” in Step 1 of submission and the Special Issue manuscript “NeuralRS19” at Step 6. The length of a manuscript must be minimum 8 and maximum 9 pages in IEEE format.

IEEE TBioCAS Special Issue - Wearable and Flexible Integrated Sensors for Screening, Diagnostics, and Treatment (WFISEDIT19)

Submitted by guoxing.wang on February 11, 2019 - 3:56am

CALL FOR PAPERS FOR THE SPECIAL ISSUE (Deadline Extended)

PDF icon tbiocas_si_wisedt19_extended.pdf

Emerging flexible and wearable physical sensing devices create huge potential for many vital healthcare and biomedical applications including artificial electronic skins, physiological monitoring and assessment systems, and therapeutic and drug delivery platforms etc. Monitoring of vital physiological parameters in hospital and/or home conditions has been of tremendous interests to doctors and healthcare practitioners for a long time. Physiological signals are important indicators of the vital signs of human health, and real-time monitoring of physiological signals can predict, diagnose, and potentially prevent life threatening conditions, such as for stoke, cancers, cardiovascular disease, hypertension, diabetes, neural disorder, chronic pain, obesity, etc. Furthermore, a real-life long-term monitoring of health could quantify the impact of treatment at home care. The IEEE Transactions on Biomedical Circuits and Systems (TBioCAS) will publish a Special Issue devoted to Wearable and Flexible Integrated Sensors and Systems. The goal of this special issue is (i) to provide a roadmap of circuits and systems for wearable and flexible sensor device; (ii) to encourage cross-disciplinary collaboration in this emerging research field; and (iii) to report the state-of-art development of these circuits and devices with translational potential into the clinics. This special Issue brings together members of our communities to broaden their knowledge in emerging areas of research at the interface of the life sciences and the circuits and systems engineering.

 

Manuscripts describing original circuits/systems and bio validation (experimental or clinical) as well as reviews of emerging directions are solicited for this special issue, covering a range of biomedical and healthcare sensor related topics, including but not limited to: 

  • Low-power, Low-noise Circuits for Wearable Sensors
  • Wireless Integrated Sensor Microsystems and Circuits
  • Highly Sensitive and Specific Sensor Interface Circuits and Signal Processing
  • Artificial Intelligence Circuits for Sensor Reasoning, Classification and Decision
  • Power Management and Energy Harvesting Circuits for Wearable and Flexible Devices
  • Flexible Sensor Interface Circuits and Systems
  • Portable Biomedical Sensing and Imaging Circuits and Systems
  • Hybrid Biofeedback and Closed-Loop Systems
  • BioMEMS and Lab-on-Chip Sensor Interface Circuits and Systems
  • Smart Packaging for Wearable and Flexible Devices
  • Comfortable Home Monitoring Sensor Circuits and Systems

The manuscript for TBioCAS must be submitted online using the IEEE TBioCAS manuscript template and "Information for Authors", via the IEEE Manuscript Central found at the following Website address: https://mc.manuscriptcentral.com/tbcas. Authors should select the Special Issue manuscript titled “WISEDT19” instead of “Regular Paper”.  The length of a manuscript must follow IEEE format (template can be found on TBioCAS website). For any information, please contact Prof. Yuanjin Zheng at the following Email address: yjzheng@ntu.edu.sg. In addition, you can contact the other editors as indicated below.

 

Important Dates:

Submission of manuscript deadline: June 3, 2019 July 3, 2019 (Extended)
Acceptance / major-revision-resubmission / rejection notifications: July 15, 2019 August15, 2019 (Extended)
Revised manuscripts due: August 15, 2019  September15, 2019 (Extended)
Final acceptance: September 2, 2019 October 2, 2019 (Extended)
Publication: October 1, 2019 November 1, 2019 (Extended)

Guest Editors:

 

Upcoming Deadline for International Symposium on Integrated Circuits and Systems (ISICAS) 2019

Submitted by guoxing.wang on February 11, 2019 - 3:55am

The International Symposium on Integrated Circuits and Systems (ISICAS) 2019 invites high-quality submissions presenting original work in the areas of integrated circuits and systems. Topics in the areas of analog, digital, power, energy, biomedical, sensor interfaces, and communication systems are welcome. The submissions must describe integrated implementations in hybrid, SiP, or SoC forms of circuits or systems with experimental results. Extended versions of previously published recent conference papers with significant additional material are also welcome.

After the success of the first Symposium, the second will be larger and involve an additional journal. The Symposium will not produce proceedings as all accepted papers will be published in Special Issues of TCAS-I, TCAS-II, and TBioCAS shortly after the results are presented at ISICAS 2019. Author instructions may be found on our website.

All submitted manuscripts must conform to the formatting and page count limit rules set by TCAS-I, TCAS-II, and TBioCAS. The authors of accepted manuscripts, and those subject to (straightforward) minor revisions, at the time that the ISICAS 2019 Technical Program is drawn up will be asked to present their work at the Symposium. During submission, the answer to question “Please select the issue to which you are submitting:” in Step 6 of the submission process, should be “ISICAST2019”.

Organizing Committee
Franco Maloberti (University of Pavia) - General Co-Chair
Amara Amara (TdH, Lausanne, Switzerland) - General Co-Chair
Edoardo Bonizzoni (University of Pavia) - TPC Co-Chair
Jose M. de la Rosa (CNM Seville) - TPC Co-Chair
Guoxing Wang (Shanghai Jiao Tong University) - TPC Co-Chair
Alessandro Cabrini (University of Pavia) - Finance & Website Chair
Marta Daffara (Pragma Congressi) - Organizing Secretariat