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IEEE Circuits and Systems Society Newsletter Volume 16, Issue 5, October 2022

1 month 2 weeks ago
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CASS Newsletter Volume 16, Issue 5 Contents

  • Society News
    • CASS New Initiative: Standards Activities Sub Division (SASD)
  • Chapter News
    • Post Event Report on IEEE CASS DAY 2022 Malaysia Chapter — Luthffi, Nazim and Amrallah
    • IEEE Circuits and Systems Society (CASS) Forum on Future of Semiconductor Successfully Held in Xiamen — Liang Qi
  • Educational News
    • CASS-Wide Webinar Program: Join us for the second talk!
    • IEEE CASS Seasonal School on Intelligent Chips: Integrated Sensors and Memristive Computing
  • Publication News
    • Our Editor-in-Chiefs’ Top Picks
    • JETCAS Call for Papers: Complex Cyber-Multitudinal-Physical Systems: Analysis, Decision-Making, and AI Application
    • Latest Tables of Contents of CAS Sponsored Journals
  • Call for Papers & Invitations
    • IEEE ISCAS 2023, Monterey, USA (May 2023)
    • VCIP 2022, Suzhou, China (December 2022)
    • APCCAS 2022, Shenzhen, China (November 2022)
    • LASCAS / PRIME-LA 2023, Quito, Ecuador (February 2023)
    • NEWCAS 2023, Edinburgh, Scotland (June 2023)
    • AICAS 2023, Hangzhou, China (June 2023)
    • RFIC 2023, San Diego, USA (June 2023)

Schedule & Submission
This newsletter is published bimonthly and the tentative publication dates are in the middle of February, April, June, August, October, and December. Except for the inaugural issue which had experienced some delay, all issues are scheduled to appear on the 15th of the month of publication. However, a few days of delay or advancement is possible due to various administrative or logistical problems.

Your contributions are welcome. Any suitable contribution will appear in the next issue. The tentative cut-off dates for submission of contributions are the 10th of the month of publication. For example, if you wish to publish an article for the June issue, you should send it to the Editor-in-Chief or any Associate Editor before 10 June. All contributions will go through a very brief suitability screening

Chi K. (Michael) Tse
Editor-in-Chief
Email: (Click to show email)