Editor-in-Chief

Yajun Ha
School of Information Science & Technology
Shanghai Tech University
hayj@shanghaitech.edu.cn

Associate Editor-in-Chief

Edoardo Bonizzoni
University of Pavia
Department of Electrical, Computer, and Biomedical Engineering
edoardo.bonizzoni@unipv.it

Digital Communications Associate Editor-in-Chief

Sebastian Hoyos
Texas A&M University 
Department of Electrical and Computer Engineering
hoyos@tamu.edu

Associate Editors

The following distinguished team of associate editors is in charge of selecting papers for the IEEE Transactions on Circuits and Systems II: Express Briefs:

 

First NameLast NameAffiliation
BijanAlizadehUniversity of Tehran, Iran
JasonAndersonUniversity of Toronto, Canada
JohanBauwelinckGhent University, Belgium 
Hansraj SinghBhamraBroadcom, USA
SoumyaBoseIntel Labs, USA
AndreaCalimeraPolitecnico di Torino, Italy
LuisCamuñas-MesaInstitute of Microelectronics of Seville, IMSE-CNM (CSIC/University of Seville), Spain
LiChaiWuhan University of Science and Technology, China 
Mrityunjoy ChakrabortyIndian Institute of Technology, Kharagpur, India
MingyiChenShanghai Jiao Tong University, China
Chi-TsunCheng RMIT University, Australia 
CarloCondoHuawei Paris Research Center, France
Luis Fernando Costa Alberto University of Sao Paulo, Brazil
JinliangDingNortheastern University, China
Zhengtao DingThe University of Manchester, UK
Gordana Jovanovic DolecekINAOE, Mexico
HairongDongBeijing Jiaotong University, China
HaibinDuanBeihang University, China
YongchunFangNankai University, China
QuanyuanFengSouthwest Jiaotong University, China
LuGanBrunel University, UK
Weinan GaoFlorida Institute of Technology, USA
XiaohuaGeSwinburne University of Technology, Australia
LiGengXi'an Jiaotong University, China
PatrickGirard University of Montpellier / CNRS, France
JoãoGoesUniversidade Nova de Lisboa, Portugal
UlkuhanGulerWorcester Polytechnic Institute, USA
NavneetGuptaWestern Digital, India
NavneetGuptaWestern Digital, India
ChangchunHuaYanshan University, China
ChengHuangIowa State University, USA
KejieHuangZhejiang University, China
MiaoqingHuangUniversity of Arkansas, USA
HanjunJiangTsinghua University, China
Junmin            JiangSouthern University of Science and Technology, China
WeiwenJiangGeorge Mason University, USA
Zhong-Ping Jiang New York University, USA
DeepuJohnUniversity College Dublin, Ireland
SantanuKapatIndian Institute of Tech. Kharagpur, India
RajendraKattiUniversity of Washington Tacoma, USA
Kyu-hyounKimIBM Thomas J. Watson Research Center, USA
JaydeepKulkarniThe University of Texas at Austin, USA
AkashKumarTU Dresden, Germany
GuangyongLiUniversity of Pittsburgh, USA
XiaoweiLiInstitute of Computing Technology, Chinese Academy of Science, China
JunLinNanjing University, China
YingyanLinRice University, USA
HaoLiuNorth China Electric Power University, China
JianxingLiuHarbin Institute of Technology, China
QiyuanLiuQualcomm Incorporated, USA
ShibingLongUniversity of Science and Technology of China, China
XinLouShanghaiTech University, China
Herbert H. C. LuUniversity of Western Australia, Australia
Delin LuoXiamen University, China
XiangshuiMiaoHuazhong University of Science and Technology, China
VeeracharyMummadiIndian Institute of Technology Delhi, India
DanteMuratoreDelft University of Technology, The Netherlands
Erivelton Geraldo NepomucenoFederal University of São João del-Rei, Brazil
Luis B.OliveiraFacultade de Ciências e Tecnologia, Portugal
HangueParkTexas A&M University, USA
LiangQiShanghai Jiao Tong University, China
LiboQianNingbo University, China
GangQuUniversity of Maryland, USA
XinboRuanNanjing University of Aeronautics and Astronautics, China
VishalSaxenaUniversity of Delaware, USA
Chiu-WingShamUniv. of Auckland, New Zealand 
Sai-WengSinUniversity of Macao, Macao
Ramalingam SridharUniversity at Buffalo, USA
ChristophStuderETH Zurich, Switzerland
TadashiSuetsuguFukuoka University, Japan
SachinTanejaIntel Labs, USA
ShuilinTianApple Inc, USA
Kin-FaiTongUniversity College London, UK
Rangharajan VenkatesanNvidia, USA
Khurram Waheed NXP Semiconductors, USA
JeffreyWallingVirginia Tech, USA
CongWangShandong University, China
JingWangNorth China University of Technology, China
YanzhiWangNortheastern University, USA
YinWangNanjing University of Aeronautics and Astronautics, China
XiaoqunWuWuhan University, China
YinshuiXiaNingbo University, China
JunfeiXieSan Diego State University, USA
JinjunXiongUniversity at Buffalo, USA
Mustak ErhanYalcin Istanbul Technical University, Turkey
HaigangYangInstitute of Electronics, CAS, China
JunYangSoutheast University, China
MohammadYavariAmirkabir University of Technology (Tehran Polytechnic), Iran
HengYuUniversity of Nottingham Ningbo China, China
JunzhiYuPeking University, China 
ZhiyiYuSun Yat-sen University, China
XiaoyangZengFudan University, China
ChuanZhangSoutheast University, China
XiZhangBeijing Institute of Technology, China
Youmin ZhangConcordia University, Canada;
WenfengZhaoBinghamton University, USA
YanlongZhaoAcademy of Mathematics and Systems Science, CAS, China
YueZhengNanyang Technological University, Singapore
XiZhuUniversity of Technology Sydney, Australia

1) Promptly assign papers for review, review papers, and offer publication decisions.Associate editors are expected to help maintain and improve the standards and the quality of the journal by participating in the following ways.

2) Check every paper for previously published material and make sure at least 30% new material is included. Special attention is required for special issues of conference papers.
3) Support the journal through submission of your own papers, where appropriate to the journal.
4) Support the journal through paper submissions when appropriate.
5) Publicize the journal by encouraging colleagues to submit when appropriate and promoting at relevant conferences (IEEE and others).
6) Attend editorial board meetings when possible.
7) Provide active feedback to the editors on the coverage and quality of papers.