Editor-in-Chief 

Professor Feng Wu
University of Science and Technology of China, China

Associate Editor-in-Chief 

Wenwu Zhu
Tsinghua Univerisity Department of Computer Science, China

Associate Editor-in-Chief, Digital Communications

Li Zhu
University of Missouri, USA

Associate Editor 

The following distinguished team of associate editors is in charge of selecting papers for the IEEE Transactions on Circuits and Systems for Video Technology:

Luciano Volcan Agostini

Federal Univ. of Pelotas (UFPel), Brazil

Salman Asif

Univ. of California Riverside, USA

Paolo Bestagini

Politecnico di Milano, Italy

Xiaochun Cao

Chinese Academy of Sciences, China

Xun Cao

Nanjing Univ., China

Zhenzhong Chen

Wuhan Univ., China

Jianle Chen

Qualcomm Inc., USA

Zhibo Chen

Univ. of Science and Technology of China, China

Lark Kwon Choi

Qualcomm, USA

Yang  Cong

State Key Laboratory of Robotics, China

Guilherme Ribeiro Corrêa

Federal Univ. of Pelotas, Brazil

Fernando Diaz-de-Maria

Universidad Carlos III de Madrid, Spain

Richard Dorrance

Intel Corp., USA

Shan Du

The Univ. of British Columbia – Okanagan, Canada

Chuang Gan

MIT-IBM Watson AI Lab, USA

Shenghua Gao

Shanghai Tech Univ., China

Yihong Gong

Xi'an Jiaotong Univ., China

Dan Grois

Comcast Corporation, Israel

Jing-Ming Guo

National Taiwan Univ. of Science and Technology, Taiwan

Junwei Han

Northwestern Polytechnical Univ., China

Mahmoud Reza Hashemi

Univ. of Tehran, Iran, Islamic Republic of

Zhihai He

Univ. of Missouri, USA

Junhui Hou

City Univ. of Hong Kong, Hong Kong

Chao-Tsung Huang

National Tsing Hua Univ., Taiwan

Qingming Huang

Univ. of Chinese Academy of Sciences, China

Helen Huang

Univ. of Chinese Academy of Sciences, China

Byeungwoo Jeon

Sungkyunkwan Univ., Korea

Chaker Larabi

Université de Poitiers, France

Hongliang Li

Univ. of Electronic Science and Technology of China, China

Wanqing Li

Univ. of Wollongong, Australia

Xuelong Li

Chinese Academy of Sciences, China

Xi Li

Zhejiang Univ., China

Zhifeng Li

Tencent, China

Sheng Li

Univ. of Georgia, USA, USA

Xiaobai Li

Univ. of Oulu, Finland

Zhengguo Li 

Institute for Infocomm Research, Singapore

Weiyao Lin

Shanghai Jiao Tong Univ., China

Shan Liu

Tencent, USA

Wei  Liu

Tencent AI Lab, China

Jingen Liu

JD.COM Silican Valley Research Center, USA

Jiaying Liu

Peking Univ., China

Jiwen Lu

Tsinghua Univ., China

Huchuan  Lu

Dalian Univ. of Technology, China

Enrico Magli

Politecnico di Torino, Italy

Angshul Majumdar

Indraprastha Institute of Information Technology Delhi, India

Lucio Marcenaro

Univ. of Genova, Italy

José María Martìnez

Universidad Autónoma de Madrid, Spain

Tao Mei

JD.COM, China

Jingjing Meng

Univ. at Buffalo, SUNY, USA

Hongying Meng

Brunel Univ. London, UK

Grzegorz Pastuszak

Warsaw Univ. of Technology, Poland

Manoranjan Paul

Charles Sturt Univ., Australia

Wen-Hsiao Peng

National Chiao Tung Univ., Taiwan

Yuxin Peng

Peking Univ., China

Fernando Pescador

Universidad Politécnica de Madrid, Spain

Guo-Jun Qi

Univ. of Central Florida, USA

Yaxiao Qin

Analog Device Inc  based in USA, UAS

Chae Eun Rhee

Inha Univ., Korea, Republic of

Yong Man Ro

KAIST, Korea, Republic of

Gustavo Sanchez

Instituto Federal Farroupilha, Brazil

Mohamed Sami Shehata

UBC-Okanagan Campus, Canada

Bin Sheng

Shanghai Jiao Tong Univ., China

Humphrey Shi

Univ. of Oregon, USA

Jaya Sreevalsan-Nair

International Institute of Information Technology Bangalore, India

Vladimir Stankovic

Univ. of Strathclyde, UK

Hongbin Sun

Xi'an Jiaootong Univ., China

Yap-Peng Tan

Nanyang Technological Univ., Singapore

Zheng Tang

Amazon, USA

Yonghong Tian

Peking Univ., China

Qi Tian

Univ. of Texas at San Antonio, USA

Vladan Velisavljevic

Univ. of Bedfordshire, UK

Yu Wang

Tsinghua Univ., China

Jingdong  Wang

Microsoft Research, China

Qi Wang

Northwestern Polytechnical Univ., China

Changhu Wang

Bytedance Technology Co., Ltd., China

Honggang Wang

Univ. of Massachusetts Dartmouth, USA

Shuihua Wang

Loughborough Univ., UK

Zhangyang Wang

Texas A&M Univ., USA

Xinchao Wang

Stevens Institute of Technology, USA

Mathias Wien

RWTH Aachen Univ., Germany

Qingming Jonathan Wu

Univ. of Windsor, Canada

Chuan Wu

The Univ. of Hong Kong, Hong Kong

Yue Wu

Amazon.com, USA

Jiamin Wu

Tsinghua Univ., China

Hongkai Xiong

Shanghai Jiao Tong Univ., China

Jing-Hao Xue

Univ. College London, UK

Yan Yan

Washington State Univ., USA

Yi  Yang

Univ. of Technology Sydney, Australia

Yimin Yang

Lakehead Univ., Canada

Qixiang Ye

Univ. of Chinese Academy of Sciences, China

Jun Yu

Hangzhou Dianzi Univ., China

Lu Yu

Zhejiang Univ., China

Huanjing Yue

Tianjin Univ., China

Bruno Zatt

Federal Univ. of Pelotas, Brazil

Huanqiang Zeng

Huaqiao Univ., China

Zheng-Jun Zha

Univ. of Science and Technology of China, China

Yudong Zhang

Univ. of Leicester, UK

Lei Zhang

Microsoft, USA

Tianzhu Zhang

Univ. of Science and Technology of China, China

Zhaoxiang Zhang

Chinese Academy of Sciences, China

Fan Zhang

Univ. of Bristol, UK

Guoying Zhao

Univ. of Oulu, Finland

Yao Zhao

Beijing Jiaotong Univ., China

Liang  Zheng

Australian National Univ., Australia

Yicong Zhou

Univ. of Macau, Macao

Shuyuan Zhu

UESTC, China

Maggie Zhu

Purdue Univ., USA

Associate editors are expected to help maintain and improve the standards and the quality of the journal by participating in the following ways:

1) Promptly assign papers for review, review papers, and offer publication decisions.
2) Check every paper for previously published material and make sure at least 30% new material is included. Special attention is required for special issues of conference papers.
3) Support the journal through submission of your own papers, where appropriate to the journal.
4) Support the journal through paper submissions when appropriate.
5) Publicize the journal by encouraging colleagues to submit when appropriate and promoting at relevant conferences (IEEE and others).
6) Attend editorial board meetings when possible.
7) Provide active feedback to the editors on the coverage and quality of papers.

Manuscript Central

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