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CASS Student Travel Support for Non-Flagship Financially Co-Sponsored Conferences - Round Two

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The submission deadline is 15 September 2023.
1 month 1 week ago
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Announcing the second call for CASS Student Travel Support for travel to Non-Flagship Financially Co-Sponsored Conferences

The IEEE Circuits and Systems Society (CASS) is pleased to announce its second call for Student Travel Support for travel to CASS Non-Flagship Financially Co-Sponsored Conferences. The CAS Society aims to enable the recipients to present their research work at CASS Financially Co-Sponsored Conferences

Important Dates:

  • Submission deadline: 15 September 2023

The amount of financial assistance provided to each selected student will be given through a reimbursement process. For virtual conferences, registration fees can be supported. The travel support is limited to 2023 conferences that are financially co-sponsored by the CAS Society. Please see the list provided below. 

Selection Criteria:

  • Students must be CASS student members at the time of the application.
  • Students must have had their papers selected for presentation at the conference they plan to attend or have attended.
    • In the case that the grant is for attending a conference occurring after the grant application deadline, a faculty member must confirm that the nominee is an undergraduate or graduate student.
    • In the case of reimbursement for attending a conference that occurred before the application deadline, a faculty member must confirm that the nominee was an undergraduate or graduate student at the time of the conference. 
  • Eligibility will also be based on financial needs, financial support will not exceed $1,000 USD per student.
  • An individual shall not be eligible for travel support more than once per year. 

CASS 2023 Financially Co-Sponsored Conferences:

  • 2023 28th Asia and South Pacific Design Automation Conference (ASP-DAC)
  • 2023 International Forum on MPSoC for Software-Defined Hardware (MPSoC)
  • 2023 IEEE International Conference on Multimedia and Expo (ICME)
  • 2023 IEEE International Conference on Multimedia and Expo Workshops (ICMEW)
  • 2023 IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED)
  • 2023 IEEE 36th International System-on-Chip Conference (SOCC)
  • 2023 Embedded Systems Week (ESWEEK)
  • 2023 IEEE Conference on AgriFood Electronics (CAFE)
  • 2023 IFIP/IEEE 31st International Conference on Very Large Scale Integration (VLSI-SoC)
  • 2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD)
  • 2023  IEEE Nordic Circuits and Systems Conference (NorCAS)
  • 2023 IEEE Symposium on Integrated Circuits and Systems Design (SBCCI)  

Non-Flagship Conference Travel Support Submission Form