Ibrahim (Abe) Elfadel

Ibrahim (Abe) Elfadel

Khalifa University
IEEE Region
Region 08 (Africa, Europe, Middle East)
Technical Area
Biomedical and Life Science Circuits and Systems, Circuits and System for Artificial Intelligence, Digital Signal Processing, Internet of Things (IoT), Nonlinear Circuits and Systems, Quantum Technology, Sensory Systems
Spoken Languages



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Dr. Ibrahim (Abe) M. Elfadel received his PhD from MIT in 1993 and has been Professor of Computer Engineering at Khalifa University, Abu Dhabi, UAE, since 2011. He is also the founder and CEO of Laboos Technologies, a UAE startup for medical wearables. Between May 2013 and April 2018, he served as the founding co-director of the Abu Dhabi SRC Center of Excellence on Energy-Efficient Electronic Systems (ACE4S). From May 2014 until April 2019, he served as the Program Manager of Mubadala's TwinLab MEMS, a joint collaboration with the Institute of Microelectronics in Singapore on micro-electromechanical systems. Between Nov 2012 and Oct 2015, he was the founding director of Mubadala's TwinLab 3DSC, a joint research center on 3D integrated circuits with the Technical University of Dresden, Germany. He also headed the Masdar Institute Center for Microsystems(iMicro) from Nov 2013 until Mar 2016. Prior to joining academia, Dr. Elfadel had a 15-year R & D career with IBM, Yorktown Heights, NY, as a Research Staff  Member and Senior Scientist involved in the research, development, and deployment of software tools and methodologies for the design of IBM's high-end microprocessors. He currently leads the Advanced Digital Systems Laboratory at Khalifa University with a portfolio of sponsored research covering the full scope of cyber physical systems and including projects in biomedical sensing, embedded signal processing, edge and cloud computing,and secure reconfigurable computing.

Dr. Elfadel is the recipient of six Invention Achievement Awards, one Outstanding Technical Achievement Award and one Research Division Award, all from IBM, for his contributions in the area of computer-aided microprocessor design. He is the inventor of 55 issued US patents with many internationally filed, and the author of more than 170 archival articles. In 2014, he was the recipient of the D. O. Pederson Best Paper Award from the IEEE Transactions on Computer-Aided Design for Integrated Circuits and Systems. In 2018, he received the Board of Directors Recognition Award from the Semiconductor Research Corporation for "Pioneering Semiconductor Research in Abu Dhabi." Most recently, he received the 2022 Service Award from the International Federation on Information Processing for his "Outstanding Contributions to IFIP and the Informatics Community." Dr. Elfadel is the lead co-editor of the following books: "Machine Learning Methods in VLSI Computer-Aided Design," Springer 2019 (40,000+ chapter downloads), "The IoT Physical Layer: Design and Implementation," Springer, 2019, and "3D Stacked Chips: From Emerging Processes to Heterogeneous Systems," Springer, 2016. Between 2009 and 2013, Dr. Elfadel served as an Associate Editor of the IEEE Transactions on Computer-Aided Design and is currently serving as Associate Editor of the IEEE Transactions on VLSI. Dr. Elfadel has served on the Technical Program Committees of IEEE flagship conferences, including ISCAS, BioCAS, DAC, ICCAD, ASPDAC, DATE, ICCD, ICECS, MWSCAS, AICAS, and VLSI-SoC. He was the General Co-chair of the IFIP/IEEE 25th International Conference on Very Large Scale Integration (VLSI-SoC), Abu Dhabi, UAE, October 2017, is the Technical Program Co-chair of the IEEE Artificial Intelligence Circuits and Systems (AICAS 2023), Hangzhou, China, June 2023, an will be the Technical Program Co-chair of VLSI-SoC 2023, Sharjah, UAE, Oct 2023. He has been the Co-organizer of the 1st, 2nd , 3rd, and 4th Accelerator CAD Workshops, Co-located with the IEEE/ACM International Conference on Computer Aided Design in 2019, 2020, 2021, and 2022.

IEEE CASS Position History:
  • Present   Committee Members (Sensory Systems TC)
  • 2024-Present   Associate Editor (IEEE Transactions on Circuits and Systems for Artificial Intelligence (TCASAI) Editorial Board)
  • 2022-Present   Associate Editor TVLSI (IEEE Transactions on Very Large Scale Integration Systems (TVLSI) Editorial Board)
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