Kee-Bong Song headshot
United States of America

Kee-Bong Song

Affiliation
Samsung Semiconductor Inc.
(
Industry
)
IEEE Region
Region 06 (Western U.S.)
Technical Area
Analog and Mixed Signal Circuits and Systems, Circuits and System for Artificial Intelligence, Circuits and Systems for Communications, Digital Signal Processing, Electronic Design Automation, Visual Signal Processing and Communications
Email

Contact Menu

Kee-Bong Song (S'02-M'06-SM'24) received his B.S degree of EECS from Korea Advanced Institute of Science and Technology (KAIST) in 2000, Daejeon, South Korea and M.S and Ph.D. degrees in EE from Stanford University, California USA in 2002 and 2005 respectively. From August 2004 to September 2005, he was a system engineer with Qualcomm Technology and Ventures (QT&V) and Corporate R&D groups. From October 2005 to February 2009, he was with Amicus Wireless Inc., a Silicon Valley startup for the mobile WiMAX modem chipset development. From February 2009 to December 2012, he was with Apple as a manager in iOS Wireless Systems engineering team. Since 2013 he has been with Samsung where he is currently a Senior Vice President and the head of System LSI US R&D Center in Samsung Semiconductor Inc., overseeing the Multimedia, AI, 5G/6G modem systems R&D and commercialization of Samsung’s Exynos System-On-Chip (SOC), Modem and Connectivity products. Dr. Song’s research interest includes wireless communication, signal processing algorithms for Modem-RF systems, machine learning and AI. He holds over 80 US/international patents and have published more than 30 research papers in these areas and research topics. He was an appointed industry member of IEEE Circuit and Systems Society (CASS) Board of Governor for 2024 and is currently a member of Industry Division of CASS.

Outdated or incorrect information? Please click here to update us with the correct information.