Xinmiao Zhang
Xinmiao Zhang
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Xinmiao Zhang received her Ph.D. degree in Electrical Engineering from the University of Minnesota, Twin Cities. She is currently a Professor at The Ohio State University and was a Timothy E. and Allison L. Schroeder Assistant Professor (2005-2010) and Associate Professor (2010-2013) at Case Western Reserve University. Between her academic careers, she was a Senior Technologist at Western Digital/SanDisk (2013-2017). She is also a member of the core faculty of the Translational Data Analytics Institute of The Ohio State University. She held visiting positions at Polytechnic University of Turin (2024), the University of Washington, Seattle (2011-2013), and Qualcomm (2008).
Prof. Zhang is a recipient of the NSF CAREER Award 2009, the College of Engineering Lumley Research Award at The Ohio State University 2022, the Bob Owens Best Student Paper Award at the IEEE Workshop on Signal Processing Systems, Best Paper Award at ACM Great Lakes Symposium on VLSI 2004, and Best Paper Award at International SanDisk Technology Conference 2016. Prof. Zhang was elected the Vice President-Technical Activities of the IEEE Circuits and Systems Society (CASS) for the 2022-2023 term and served on the Board of Governors of CASS for the 2019-2021 term. She is a Fellow of IEEE. She was also the Chair (2021-2022) and a Vice-Chair (2017-2020) of the Data Storage Technical Committee (DSTC) of the IEEE Communications Society. Prof. Zhang has served on the organization and technical committees of many conferences, including ISCAS, SiPS, ICC, GLOBECOM, NVMW, and GLSVLSI. She is the Associate Editor-in-Chief of the IEEE Transactions on Circuits and Systems-I (TCAS-I) 2024-2025. She has also been an Associate Editor of TCAS-I 2010-2019 and IEEE Open Journal of Circuits and Systems (OJCAS) since 2019. She is a recipient of the Best Associate Editor Award in 2013 and 2021.
- Present VSA TC Member (VLSI Systems and Applications Technical Committee (VSA TC))
- 2026-Present Associate Editor-in-Chief (IEEE Transactions on Circuits and Systems Part I: Regular Papers (TCAS-I) Editorial Board)
- 2026-Present Member (Mac Van Valkenburg Award Subcommittee)
- 2026-Present Member (Darlington and Guillemin-Cauer Best Paper Awards Subcommittee)
- 2026-Present Member (Very Large Scale Integration Systems Best Paper Award Subcommittee)
- 2024-Present Signal Processing Society (Representatives to other IEEE Entities)
- 2022-Present CASCOM TC Member (Circuits and Systems for Communications Technical Committee (CASCOM TC))
- 2024-2025 Associate Editor-in-Chief (IEEE Transactions on Circuits and Systems Part I: Regular Papers (TCAS-I) Editorial Board)
- 2022-2023 Chair (Technical Activities Division)
- 2022-2023 Vice President - Technical Activities (Executive Committee)
- 2022-2023 SASD Voting Members (Standards Activity Subdivisions Committee (SASD))
- 2021-2021 Member (Mac Van Valkenburg Award Subcommittee)
- 2021-2021 Member (Technical Activities Division)
- 2019-2021 2022-2024 Member at Large (Board of Governors)
- 2022- Associate Editor (IEEE Open Journal of Circuits and Systems Editorial Board)
- 2025 IEEE Fellow