Acronym
CASIF 2023

IC Design Challenge in AI Era: An event by IEEE CAS Taipei Chapter

Date
Geographic Location
New Taipei, Taiwan

Event Menu

Description

This forum will be a half-day conference to include keynote, technical talk and panel discussion. It will bring experts together from leading industry companies, such as TSMC and MediaTek, important research institutes, such as ITRI and TSRI, and top universities, such as National Taiwan University, National Tsing Hua University and National Yang Ming Chiao Tung University. This forum will focus on IC design challenge in AI era, and open opportunities for technical discussion, knowledge sharing, networking and collaboration. The Forum welcome anyone with an interest in this field, including designers, researchers, and engineers from industry, research institute and academia.It is a hybrid event. The participants are welcomed to attend this event in physical, and video conference casting also provided for registered persons who cannot attend in physical.

To encourage more participants to attend the forum in physical, the organizing committee use three methods on event planning:

First, inviting related co-organizers to reach more people interested on this topic. This forum is organized by IEEE CAS Taipei, and co-organized with several important industrial or academic organizations, such as MediaTek Advanced Research Center, Taiwan Semiconductor Industry Association (TSIA), Taiwan IC Industry & Academia Research Alliance (TIARA), RISC-V Taiwan Alliance, and AI on Chip Taiwan Alliance (AITA).

Second, co-location with Taiwan Innotech Expo (TIE), which is a huge expo which attracts attendees from IC industries and academics. Last year, TIE 2022 has attracted 18,917 domestic and international visitors. The organizing committee expects co-location with Taiwan Innotech Expo will encourage participants to attend this industrial forum in physical.

Third, co-location with RISC-V Taipei Day. IEEE CASIF in the morning session and RISC-V Taipei day in the afternoon session. RISC-V is a hot topic in IC design. The potential participant of IEEE CASIF may be also interested with RISC-V, the open processor architecture. Co-marketing both conferences could be beneficial in attracting attendees. Besides, due to co-location, both organizations can share the cost. RISC-V Taiwan Alliance will spend for conference room and large LED screen, and IEEE CAS Taipei will spend for the audio equipment and lunch in TICC .

General Chair(s)
Program/Technical Chair(s)