Marco Ballini (Member, IEEE) received the Ph.D. degree in electrical engineering from ETH Zürich, Zürich, Switzerland, in 2013, with a focus on the design of CMOS-based microelectrode arrays. He was an Analog IC Designer and a Senior Researcher with imec, Leuven, Belgium. In 2021, he joined TDK InvenSense, Milan, Italy, where he is currently a System Design Engineer and an ASIC Architect (Senior Staff). His research interests include low-noise, low-power and small-area analog and mixed-signal circuits for sensors, bioelectronics, and neural interfaces. He is a member of the Solid-State Circuits Society (SSCS) and Circuits and Systems (CAS). He served as an Associate Editor for the IEEE Open Journal of Circuits and Systems (OJCAS) from 2019 to 2023 and he is currently an Associate Editor of the IEEE Transactions on Circuits and Systems I: Regular Papers (TCAS-I).