Post Type
Announcement

IEEE Circuits and Systems Society Newsletter Volume 18, Issue 5, October 2024

10 months 2 weeks ago
Share on:
Body

CASS Newsletter Volume 18, Issue 5 Contents

CONTENTS

  • Society News
    • Announcing the Results of the IEEE CASS Board of Governors Election
    • IEEE CASS Trivia Contest
    • Call for CASIF Proposals Round Three
  • Chapter News
    • IEEE CAS Day at Changsha, Hunan — Zhong Kuncai and Jian Zhao
  • Publication News
    • Our Editors-in-Chief’s Top Picks
    • IEEE CAS Magazine Third Quarter Issue 2024
    • JETCAS Call for Papers: Generative AI Compute: Algorithms, Architectures, and Applications to CAS
    • IEEE JETCAS Call for Papers: 2.5D/3D Chiplet Circuits and Systems, EDA Advanced Packaging, and Test
    • Latest Tables of Contents of CAS Sponsored Journals
  • Call for Papers & Invitations
    • IEEE ISCAS 2025, London (May 2025)
    • APCCAS 2024, Taipei, Taiwan (November 2024)
    • ICECS 2024, Nancy, France (November 2024)
    • SiPS 2024, Cambridge MA, USA (November 2024)
    • ICM 2024, Doha, Qatar (December 2024)
    • ASP-DAC, Tokyo, Japan (January 2025)
    • LASCAS 2025, Bento Gonçalves, Brazil  (February 2025)
    • AICAS 2025, Bordeaux, France (April 2025)
    • RFIC 2025, San Francisco, USA (June 2025)

Schedule & Submission
This newsletter is published bimonthly and the tentative publication dates are in the middle of February, April, June, August, October, and December. Except for the inaugural issue which had experienced some delay, all issues are scheduled to appear on the 15th of the month of publication. However, a few days of delay or advancement is possible due to various administrative or logistical problems.

Your contributions are welcome. Any suitable contribution will appear in the next issue. The tentative cut-off date for submission of contributions is the 10th of the month of publication. For example, if you wish to publish an article for the June issue, you should send it to the Editor-in-Chief or any Associate Editor before 10 June. All contributions will go through a very brief suitability screening

Chi K. (Michael) Tse
Editor-in-Chief
Email: (Click to show email)