Acronym ISLPED 2024 Title 2024 IEEE/ACM International Symposium on Low Power Electronics and Design Date 5 Aug 2024 – 7 Aug 2024 Geographic Location Newport Beach, California, USA IEEE Region Region 06 (Western U.S.)
Acronym MWSCAS 2024 Title 2024 IEEE 67th International Midwest Symposium on Circuits and Systems Date 11 Aug 2024 – 14 Aug 2024 Geographic Location Springfield, MA, US IEEE Region Region 01 (Northeastern U.S.)
Acronym ISOCC 2024 Title 2024 International SoC Design Conference Date 19 Aug 2024 – 22 Aug 2024 Geographic Location Sapporo, Japan IEEE Region Region 10 (Asia and Pacific)
Current 2023 - 2025 Dong Tian Affiliation Senior Director | Senior Principal Engineer at InterDigital, Inc. IEEE Region Region 01 (Northeastern U.S.) Email Email Past 2021 - 2022 Country TWN Wen-Huang Cheng Affiliation National Taiwan University IEEE Region Region 10 (Asia and Pacific) Email Email Website Website
Dong Tian Affiliation Senior Director | Senior Principal Engineer at InterDigital, Inc. IEEE Region Region 01 (Northeastern U.S.) Email Email
Country TWN Wen-Huang Cheng Affiliation National Taiwan University IEEE Region Region 10 (Asia and Pacific) Email Email Website Website