JETCAS Spotlight Articles from 2025
Dear IEEE JETCAS Readers,
The IEEE Journal on Emerging and Selected Topics in Circuits and Systems (JETCAS) is proud to present spotlight articles from the issues published in 2025 so far. We hope you enjoy reading the latest research. This news piece will be updated as the new issues are published.
Best Regards,
The IEEE JETCAS Editorial Team
Wen-Hsiao Peng (Editor-in-Chief)
Shimeng Yu (Associate Editor-in-Chief)
Sergi Abadal (Associate Editor-in-Chief for Digital Communications)
JETCAS Spotlight Articles from 2025
2025/Q1: Circuits and Systems for Green Video Communications
Link to the full issue: https://ieeexplore.ieee.org/xpl/tocresult.jsp?isnumber=10924446&punumber=5503868
Selected papers:
- P. Chen, X. Fang, M. Wang, S. Wang and S. Ma, "Compact Visual Data Representation for Green Multimedia–A Human Visual System Perspective," in IEEE Journal on Emerging and Selected Topics in Circuits and Systems, vol. 15, no. 1, pp. 16-30, March 2025
https://ieeexplore.ieee.org/document/10818693 - R. Yang, D. Liu, F. Wu and W. Gao, "Learned Image Compression With Efficient Cross-Platform Entropy Coding," in IEEE Journal on Emerging and Selected Topics in Circuits and Systems, vol. 15, no. 1, pp. 72-82, March 2025
https://ieeexplore.ieee.org/document/10870272 - M. Ghasempour, H. Amirpour and C. Timmerer, "Real-Time Quality- and Energy-Aware Bitrate Ladder Construction for Live Video Streaming," in IEEE Journal on Emerging and Selected Topics in Circuits and Systems, vol. 15, no. 1, pp. 83-93, March 2025
https://ieeexplore.ieee.org/document/10877851
2025/Q2: Generative Artificial Intelligence Compute: Algorithms, Implementations, and Applications to CAS
Link to the full issue: https://ieeexplore.ieee.org/xpl/tocresult.jsp?isnumber=11050007&punumber=5503868
Selected papers:
- J. Ryu and H. -J. Yoo, "An Overview of Neural Rendering Accelerators: Challenges, Trends, and Future Directions," in IEEE Journal on Emerging and Selected Topics in Circuits and Systems, vol. 15, no. 2, pp. 299-311, June 2025
https://ieeexplore.ieee.org/document/10967345 - Y. Sun et al., "GenPolar: Generative AI-Aided Complexity Reduction for Polar SCL Decoding," in IEEE Journal on Emerging and Selected Topics in Circuits and Systems, vol. 15, no. 2, pp. 312-324, June 2025
https://ieeexplore.ieee.org/document/11007206 - G. Zhang, D. Zou, K. Sun, Z. Chen, M. Wang and Z. Wang, "GEMMV: An LLM-Based Automated Performance-Aware Framework for GEMM Verilog Generation," in IEEE Journal on Emerging and Selected Topics in Circuits and Systems, vol. 15, no. 2, pp. 325-336, June 2025
https://ieeexplore.ieee.org/document/10994474
2025/Q3: 2.5D/3D Chiplet Circuits and Systems, EDA, Advanced Packaging, and Test — Part I
Link to the full issue: https://ieeexplore.
- Y. -T. Yang and C. -M. Hung, "Heterogeneous Integration in Co-Packaged Optics," in IEEE Journal on Emerging and Selected Topics in Circuits and Systems, vol. 15, no. 3, pp. 427-437, Sept. 2025
https://ieeexplore.ieee.org/document/11087222 - W. Lu et al., "Miniaturized and Cost-Effective Programmable 2.5D/3.5D Platforms Enabled by Scalable Embedded Active Bridge Chipset," in IEEE Journal on Emerging and Selected Topics in Circuits and Systems, vol. 15, no. 3, pp. 379-391, Sept. 2025
https://ieeexplore.ieee.org/document/11104218 - J. Suzano, A. Philippe, F. Abouzeid, G. Di Natale and P. Roche, "Enhancing DFT Security in Chiplet-Based Systems With Encryption and Integrity Checking," in IEEE Journal on Emerging and Selected Topics in Circuits and Systems, vol. 15, no. 3, pp. 493-505, Sept. 2025
https://ieeexplore.ieee.org/document/11097106
2025/Q4: 2.5D/3D Chiplet Circuits and Systems, EDA, Advanced Packaging, and Test — Part II
Link to the full issue: https://ieeexplore.
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A. Delavari and B. Vaisband, "Chiplets Interface Protocol (ChIP) for Ultra-Large-Scale Applications," in IEEE Journal on Emerging and Selected Topics in Circuits and Systems, vol. 15, no. 4, pp. 585-598, Dec. 2025
https://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=11088081 -
K. Li et al., "Efficient Die-to-Die Communication: UCIe Link Simulation and Optimization in a Chiplet-Based System," in IEEE Journal on Emerging and Selected Topics in Circuits and Systems, vol. 15, no. 4, pp. 599-608, Dec. 2025
https://ieeexplore.ieee.org/document/11087237 -
H. Liu et al., "Survey of Chiplet Technology: SoC Architecture, Interconnect, EDA, and Advanced Packaging," in IEEE Journal on Emerging and Selected Topics in Circuits and Systems, vol. 15, no. 4, pp. 514-536, Dec. 2025, https://ieeexplore.ieee.org/document/11265742