Compact Low-Power mm-wave ICs for Next-Generation (5G/6G) Wireless Transceivers

Ultra-scaled active devices in both CMOS and BiCMOS technologies have reached outstanding fT/fmax, enabling an ever-increasing number of future emerging applications in the microwave/mm-wave frequency range, for the next-generation (5G/6G) wireless transceivers for communication, sensing and imaging applications.

This lecture addresses some fundamental and most severe design challenges for low-power mm-wave ICs, and advanced design methodologies that can mitigate the performance degradation and allow getting the largest potential out of the ultra-scaled technologies. It reports the design of innovative building-blocks as key enabling solutions for compact low-power mm-wave array ICs for next-generation (5G/6G) wireless transceivers.