Fakhrul Zaman Rokhani
Malaysia

Fakhrul Zaman Rokhani

Affiliation
University Putra Malaysia
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Academia
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IEEE Region
Region 10 (Asia and Pacific)
Technical Area
Biomedical and Life Science Circuits and Systems, Circuits and System for Artificial Intelligence, Circuits and Systems Education and Outreach, Electronic Design Automation, Internet of Things (IoT)
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Fakhrul Zaman Rokhani received a B.S. degree from the Universiti Teknologi Malaysia and an M.S. and Ph.D. from the University of Minnesota, USA. He is an associate professor at the Faculty of Engineering Universiti Putra Malaysia. He heads the Smart System and System-on-Chip (S3oC) research group. He was with STMicroelectronics Catania, Intel Penang Design Center, and Huawei Technologies as a visiting professor, a visiting scholar at the ASIC & Systems State Key Lab at Fudan University China, and a visiting professor at several universities in Italy, Indonesia, Sudan, and Turkey. His current research interests include low-power/energy-efficient system-on-chip (SoC) design and automation, IoT system integration, and sensors for food quality applications. He has (co)-authored more than 130 peer-reviewed articles, one country policy paper, nine books/book chapters, three magazine articles, and 25 Intellectual Properties. In 2023, he co-founded a startup company focusing on low-power I.P.s.

He serves as Vice President of Education and Communications for the CAS Society (2023-2026) and chairs the CASS Institute for Global Education and two standing committees - Education and Digital Communication (2023-2026). He is a technical committee (TC) member of VLSI Systems and Applications and Circuits and Systems Education and Outreach. On the publication front, he is/has been contributing as a Senior Associate Editor of TCAS-I (2024-2025), CASS newsletter, Guest Editor of TCAS-I and TCAS-II, and Technical Program/Publication Chair/Track chairs/Embedded Workshop Chair of several IEEE CASS conferences. At the IEEE level, he serves on the steering committee for IEEE Future Direction - Global Semiconductors.

Additional Information
I'm a member of the following TCs:
1. VLSI System Architecture
2. Education & Outreach

And also the following SIGs:
1. Flexible electronics

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